ChipMOS TECHNOLOGIES (Bermuda) LTD. (“ChipMOS”), listed on the Nasdaq National Market, (NASDAQ: IMOS) is a leading independent provider of total semiconductor testing and packaging solutions to fabless companies, integrated device manufacturers (IDM) and foundries.

We provide a broad range of back-end testing services for high density memory, mixed-signal and liquid crystal display (LCD) driver semiconductors. In addition, we offer a comprehensive selection of leadframe-based and organic substrate-based package assembly services for memory, mixed-signal, and LCD driver semiconductors which are used in diverse end-use markets, including personal computers, communications equipment, office automation and consumer electronics. Our testing and packaging services are provided both separately and on a turnkey basis.

With operations headquartered in Taiwan, most of testing is currently conducted at our facility in the Hsinchu Science Park while the packaging is mostly conducted at our Southern Taiwan Science Park facility.  We start our mainland China operation since 2003 at Qingpu Shanghai, currently providing testing and packaging services for both memory and LCD driver semiconductors.  With the successful merger of AMCT in 2003, we also provide gold bumping services at Chupei, Hsinchu.
 
In addition to our unique back-end solutions, we work in collaboration with our global client base to provide a complete range of vertically integrated solutions from design through drop-shipment.

We use our advanced engineering skills and on-going commitment to R&D to understand the technology roadmaps and needs of our customers and the constant provision of new testing and packaging solutions for an increasingly sophisticated array of semiconductors allow us to grow with our customers. The software conversion programs and parallel testing capability used by ChipMOS also enable us to enhance efficiency and reduce the cost of testing operations for our clients.

Corporate Structure